描述
| Parameter | Value |
|---|---|
| Contact Plating | Tin |
| Chassis | Surface Mount |
| Mounting Type | Surface Mount |
| Package/Case | 6-XFDFN Exposed Pad |
| Number of Pins | 6 |
| Usage Level | Military grade |
| Packaging | Tape & Reel (TR) |
| Published | 2009 |
| JESD-609 Code | e4 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Terminal Surface Treatment | Gold (Au) |
| Maximum Operating Temperature | 150°C |
| Minimum Operating Temperature | -55°C |
| Maximum Power Dissipation | 120mW |
| Voltage – Supply | 1.8V~4V |
| Structure | COMPONENT |
| Frequency | 50MHz~3.5GHz |
| Test Frequency | 1.5GHz |
| Current Source | 30mA |
| Halogen Free | Halogen Free |
| Gain | 19.5dB |
| RF/Microwave Device Type | Broadband Low Power |
| RF Type | Cellular, RKE, WiFi |
| Input Power – Max (CW) | 20dBm |
| Characteristic Impedance | 50Ohm |
| Maximum Junction Temperature (Tj) | 150°C |
| Noise Figure | 1dB |
| P1dB | -6.5dBm |
| Height | 500μm |
| Radiation Hardening | None |
| RoHS Status | ROHS3 Compliant |
| Lead-Free | Lead-Free |
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